期刊
MICROELECTRONICS JOURNAL
卷 42, 期 11, 页码 1257-1262出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.mejo.2011.08.009
关键词
High-power LED; Heat pipe; Thermal resistance; Junction temperature
资金
- Anhui Provincial Natural Science Foundation [11040606M111]
- Natural Science Foundation of Education Bureau of Anhui Province, China [KJ2010B042]
- Anhui University of Architecture
- Engineering Research Center of Buildings Energy-efficient Control and Evaluation, Ministry of Education of China [KF2009.07]
- National Natural Science Foundation of China [51076107]
The goal of this study is to improve the thermal characteristics of high power LED (light-emitting diode) package using a flat heat pipe (FHP). The heat-release characteristics of high power LED package are analyzed and a novel flat heat pipe (FHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of high power LED package with flat heat pipe heat sink have been investigated experimentally. The obtained results indicate that the junction temperature of LED is about 52 degrees C for the input power of 3 W, and correspondingly the total thermal resistance of LED system is 8.8 K/W. The impact of the different filling rates and inclination angles of the heat pipe to the heat transfer performance of the heat pipe should be evaluated before such a structure of heat pipe cooling system is used to cool high power LED system. (C) 2011 Elsevier Ltd. All rights reserved.
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