期刊
MICROELECTRONIC ENGINEERING
卷 108, 期 -, 页码 45-49出版社
ELSEVIER
DOI: 10.1016/j.mee.2013.02.061
关键词
Microwave integrated circuits (MICs); Electroless nickel (NiP) plating; Immersion gold (Au); Pattern up plating; Solderability; Bondability
Electroless NiP plating followed by immersion gold for depositing directly conductive layers on pattern alumina substrate can be used in the fabrication of microwave integrated circuits (MICs), as alternatives to the pattern up plating for which pattern in thick resist is mandatory. A complete procedure for the fabrication of microwave integrated circuits has been described for patterning alumina substrates and further some properties of the conductive patterns obtained in this manner have been investigated, like: the adhesion between the metallic pattern and substrate, solderability, bondability, geometrical & dimensional accuracies and microwave losses in microstrip configuration for a broadband power divider. (c) 2013 Elsevier B.V. All rights reserved.
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