期刊
MICROELECTRONIC ENGINEERING
卷 88, 期 1, 页码 60-63出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.mee.2010.08.021
关键词
3D-structures; Undercuts; UV-moulding; Microfabrication; UV-curing; Replication; Microdevice
资金
- Deutsche Forschungsgemeinschaft DFG
The replication of microstructures with undercuts by UV-moulding was studied. The pattern transfer from a silicon master into hard acrylate formulations results in defects by sheering away the undercut sections of the replica. By means of the admixture of high elastic acrylates to the formulation the replication of 3D-microstructures with larger undercuts could be achieved. The differences in the replication defect formation for imprinting and UV-moulding are due to the differences in the elasticity of master and replica and the dissimilar distribution of the forces at demoulding. (C) 2010 Elsevier B.V. All rights reserved.
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