期刊
MICROELECTRONIC ENGINEERING
卷 87, 期 5-8, 页码 1198-1203出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.mee.2009.12.014
关键词
Microelectromechanical systems (MEMS); Probe storage; CMOS-MEMS integration; Poly-SiGe; Cantilever; Wafer bonding; AuSn bonding; Surface micromachining; Bulk micromachining
We have demonstrated a MEMS memory device utilizing an array of cantilevered AFM probe tips fabricated directly on standard CMOS, and integrated with a ferroelectric media on a movable platform by wafer bonding. The MEMS process uses low-temperature poly-SiGe to fabricate cantilevers with sub-100 nm tips and suspended metallization to connect the tips to read-write circuitry in the CMOS. The probe tip array interfaces with a single-crystal PZT media film upon which data densities on the order of Tb/in(2) have been demonstrated. The mover is actuated electromagnetically with >100 micron stroke and sub-nm position sensing. The cantilever, mover and cap wafers are integrated using AuSn solder-based wafer bonding. (C) 2009 Elsevier B.V. All rights reserved.
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