Low-k compatible all-copper flip-chip connections

A novel fabrication technique using electroless copper deposition has been used to produce all-copper, chip-to-substrate connections. This process replaces solder by electrolessly joining copper pillars on the chip and substrate. The electroless copper joints were annealed at 180 degrees C after plating. A model was developed to explore methods for lowering the stress within the copper pillar, especially at the point where the pillar intersects the chip surface. The acceptable stress level within the copper pillars is a function of the on-chip dielectric material and the on-chip interconnect structures. In order to avoid fracture of the on-chip dielectric, the stress in the copper pillars should be less than the current lead-free solders that the all-copper pillars would be replacing. A polymer collar surrounding the copper pillars was used to support the pillars and improves thermo-mechanical reliability. The improvement in stress-reduction, ultimately leading to higher reliability was studied as a function of elastic modulus of the polymer collar support. It has been shown that the pillar stress generated during temperature cycling can be reduced by increasing the modulus of the pillar support and changing the shape of the copper pillars. Finally, three high-contrast photodefinable collar materials were characterized and tested. Nano-indentation experiments were performed to measure the mechanical properties of each material and shear tests were performed to verify the benefits of the higher elastic modulus collars. (C) 2008 Elsevier B.V. All rights reserved.