Thermomechanical analysis of residual stresses in brazed diamond metal joints using Raman spectroscopy and finite element simulation

Thermal residual stresses are one of the crucial parameters in engineered grinding tool (EGT) life and its consistency. Predicting failure of brazed diamond metal joints in EGTs is related to analyzing the thermal residual stresses during the cooling process. Thus thermal residual stresses have been simulated in a model with realistic materials properties, for instance isotropic hardening and a hyperbolic-sine creep law for SS316L and the silver-copper-titanium active filler alloy, named Cusil ABA (TM). Also, special modeling techniques such as tie constraint and sub-modeling have been used to model an intermetallic layer titanium-carbide (TiC) with dimensions in nanometers, where the rest of the model's dimensions are in millimeters. To verify the simulated stress state of the diamond, Raman-active optical phonon modes at three different paths in the diamond were measured. As the experiments with Raman spectroscopy (RS) do not deliver stress components, the solution is to directly compute the peak shift of Raman spectrum. The splitting in phonon frequencies and the mixing of phonon modes contain information about the thermal residual stresses in the diamond. Finally the shift in the phonon frequencies was calculated from the different numerical residual elastic strain components and compared to the experimental results. (c) 2012 Elsevier Ltd. All rights reserved.