Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

The microstructure evolution of electroplated copper films was characterized by electron backscatter diffraction (EBSD). Special care was taken during the preparation of the cross-sectional specimens and microstructure analysis to obtain reliable results. The film exhibited a columnar grain structure with a large fraction of twin boundaries. Annealing induced normal grain growth and caused many of the general high-angle grain boundaries to be replaced by twin boundaries, possibly by annealing twinning. [doi:10.2320/matertrans.MG200910]