期刊
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
卷 176, 期 5, 页码 387-392出版社
ELSEVIER
DOI: 10.1016/j.mseb.2010.12.008
关键词
Three-dimensional supercapacitors; Ba0.65Sr0.35TiO3 (BST); Electrochemical properties
资金
- Shanghai Fundamental Key Project [08JC1408900]
- China NSFC [50672027]
- Hong Kong Research Grants Council (RGC) [CityU 112307]
- [10520704400]
Three-dimensional (3D) supercapacitors consisting of Ba0.65Sr0.35TiO3 (BST)/NiSi2/silicon microchannel plate (MCP) stacked structure have been fabricated. The silicon MCP produced by electrochemical etching is utilized as a backbone of the 3D structure on which a nickel silicide current collector layer and Ba0.65Sr0.35TiO3 dielectric layer are deposited successively by electroless plating and the sol-gel method, respectively. The morphology and structure of the 3D BST/NiSi2/Si-MCP structure are characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD) and the electrochemical properties are determined by cyclic voltammetry (CV) and chronopotentiometry. The structure exhibits excellent capacitive behavior with a maximum capacitance of 784 F g(-1). After 700 charging/discharging cycles, the C-f decreases slightly with only a 5.7% loss and is stable after more than 700 cycles. The BST/NiSi2/Si-MCP 3D structure is a potential supercapacitor in industrial applications. (C) 2010 Elsevier B.V. All rights reserved,
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