4.7 Article

On the Hall-Petch relationship in a nanostructured Al-Cu alloy

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ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2010.08.070

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Aluminum alloys; Mechanical alloying; Nanostructured materials; Hot pressing; Hall-Petch relation

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  1. Deutscher Akademischer Austausch Dienst (DAAD) foundation, Germany

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Mechanical properties of bulk nanocrystalline Al-4Cu alloys with grain sizes from 47 to 105 nm, synthesized by mechanically alloying followed by vacuum hot pressing at different temperatures, were analysed through Hall-Petch relation. Hall-Petch analysis revealed a high frictional stress (170 MPa) and a high positive slope (0.13 MPa root m) as compared to pure Al, which has a frictional stress (15-30 MPa) and a slope (0.06-0.09 MPa root m). From a detailed evaluation of different strengthening mechanisms it is inferred that the Al(2)Cu precipitates and oxide particles are the likely reason for such high values of frictional stress and slope. (C) 2010 Elsevier B.V. All rights reserved.

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