4.7 Article

Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy

出版社

ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2009.10.048

关键词

Lead-free solder; Sn-Ag-Cu alloy; Zn addition; Tensile property; Intermetallic compound

资金

  1. National Basic Research Program of China [2004CB619306]

向作者/读者索取更多资源

Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy were investigated. It was found that after the Zn addition, the Cu6Sn5 and Ag3Sn phases were gradually replaced by the Cu5Zn8, Ag5Zn8 and AgZn3 phases and the amount of them were increased with increasing Zn content. The tensile tests showed that while the elongation of the alloy decreased with increasing Zn content, the strength was increased by Zn additions for Zn content <1 wt.%, but decreased at Zn content of 2 wt.%. The fracture surface analysis and deformed surface observation demonstrated that the fracture of the Sn-1Ag-0.5Cu-2Zn alloy was originated at the Ag5Zn8 phase. TEM observation further confirmed that the Ag5Zn8 phase was the weakness of the microstructure, accounting for the combination of the worst strength and elongation of the Sn-1Ag-0.5Cu-2Zn alloy. (C) 2009 Elsevier B.V. All rights reserved.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.7
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据