Effect of Grain Size Changes on Corrosion Behavior of Copper Produced by Accumulative Roll Bonding Process

The effect of changes in grain size on corrosion resistance of the pure tough pitch copper stripwas investigated in acidic and alkaline NaCl solutions. Accumulative roll bonding as sever plastic process was applied up to 8 cycles to produce the ultrafine graincopper. Polarization and electrochemical impedance tests were used for corrosion resistance investigations. Corrosion morphologies were analyzed by FE-SEM. Results showed that the corrosion resistance decreased up to cycle 2 and increased after rolled for the fourth time due to UFG grain formation after cycle 4. The corrosion degradation in cycle 8 was uniformand it was more intergranular for the sample of cycle 2 and the unrolled counterpart.