期刊
MATERIALS LETTERS
卷 137, 期 -, 页码 9-12出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.matlet.2014.08.075
关键词
Polymeric composites; Functional; Residual stress; Photoelastic; Deformation and fracture
资金
- National Natural Science Foundation of China [11072176, 51204121]
In this study, photoelastic method was used to investigate the residual stress in self-healing microcapsule-loaded epoxy. Photoelastic images show that the compressive residual stress exists in the region around the microcapsule. The shrinkage deformation of the epoxy matrix during the curing process is responsible for this residual stress. A tensile test was carried out on a self-healing microcapsule-loaded epoxy specimen with a precrack. The crack in the specimen propagated to rupture the microcapsule, which shows that the stress concentration induced by the inclusion is the main factor to affect the crack growth path and the residual stress is not important in the tensile fracture of the self-healing microcapsule-loaded epoxy specimen. (C) 2014 Elsevier B.V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据