期刊
MATERIALS LETTERS
卷 80, 期 -, 页码 103-105出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.matlet.2012.04.099
关键词
Electronic materials; Metallurgy; Microstructure; Interfaces; Indentation and hardness
资金
- CISCO Systems, Inc.
- National Science Council, Taiwan [NSC-100-2221-E-007-050-MY3]
The interfacial reactions of the Sn-3Ag-0.75Cu/Au/Ni solder joint before and after aging were investigated. The dual-phased (Cu,Ni)(6)Sn-5 with high (20.6 at.%) and low Ni (5.7 at.%) contents formed at the Sn-Ag-Cu/Ni interface, represented as H-(Cu,Ni)(6)Sn-5 and L-(Cu,Ni)(6)Sn-5. respectively. By employing high-speed impact test, the impact fracture morphology reveals that the H-(Cu,Ni)(6)Sn-5/L-(Cu,Ni)(6)Sn-5 interface facilitates the crack nucleation within the intermetallic compound (IMC). The indentation data shows that bulk H-(Cu, Ni)6Sn5 exhibits distinctly higher hardness and lower fracture toughness than bull: L-(Cu,Ni)(6)Sn-5. In correlating the impact fracture behavior and mechanical properties of H-(Cu,Ni)(6)Sn-5 and L-(Cu,Ni)(6)Sn-5, cracks tend to propagate through the H-(Cu,Ni)(6)Sn-5 IMC due to the relatively low fracture toughness of H-(Cu,Ni)(6)Sn-5. In addition, mechanisms for the formation of the dual-phased (Cu,Ni)(6)Sn-5 IMC are discussed in details. Crown Copyright (C) 2012 Published by Elsevier B.V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据