期刊
MATERIALS & DESIGN
卷 50, 期 -, 页码 774-781出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2013.03.045
关键词
Non-ferros metals and alloys; Brazing and soldering; Microstructure
资金
- National Science Council of the Republic of China [NSC 97-2218-E-020-004, NSC 101-2221-E-020-011]
A Sn3.5Ag0.5Cu (SAC)-XAl2O3 nano-composite solder was prepared by adding 100 nm Al2O3 to SAC (wt.%) solder. The interfacial microstructures and mechanical properties of SAC-XAl2O3 nano-composite solder balls on immersion Sn surface finished BGA joints after multiple reflows was investigated. As a whole, adding Al2O3 nanoparticles to SAC solders significantly changed in the interfacial microstructure, and both scallop-type and prism-type modes were observed in the plain SAC solder and SAC-XAl2O3 nano-composite solder after reflowing, respectively. The nanoparticles suppressed the growth of the Cu6Sn5 layer, significantly improving the shear strength. The fracture surfaces of the plain SAC solder showed a semi-brittle fracture mode, but those of the SAC-XAl2O3 nano-composite solder exhibited typical ductile failures. (c) 2013 Elsevier Ltd. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据