4.7 Article

Research on the reduction of sink mark and warpage of the molded part in rapid heat cycle molding process

期刊

MATERIALS & DESIGN
卷 47, 期 -, 页码 779-792

出版社

ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2012.12.047

关键词

Injection molding; Rapid heat cycle molding; Warpage; Sink mark

资金

  1. Program for Changjiang Scholars and Innovative Research Team in University of Ministry of Education of China [IRT0931]
  2. China Postdoctoral Science Foundation [2012M521329]
  3. Special Fund for Postdoctoral Innovative Project of Shandong Province [201201006]
  4. Shandong Province High Technology Innovation Engineering Special Plan Program [2008ZZ10]
  5. Program for New Century Excellent Talents in University [NCET-08-0337]

向作者/读者索取更多资源

Rapid heat cycle molding (RHCM) is a recently developed innovative injection molding technology to enhance the surface quality of the plastic parts without extending the molding cycle. Most of the common defects that occur in the plastic parts produced by conventional injection molding (CIM), such as flow mark, silver mark, jetting mark, weld mark, exposed fibers, short shot, etc., can be well solved by RHCM. However, RHCM is not a nostrum for all the defects in injection molding. Sink mark and warpage are two major defects occurring in RHCM. The purpose of this study is to investigate and further solve the sink mark and warpage of the molded parts in RHCM. To solve the problem of sink mark, a new bench form'' structure for the screw stud on the product coupling with a lifter structure for the injection mold was proposed. The external gas assisted packing was also proposed to reduce the sink mark in RHCM. To solve the problem of warpage, design of experiments via Taguchi methods were performed to systematically investigate the effect of processing parameters including melt temperature, injection time, packing pressure, packing time and also cooling time on the warpage. Injection molding simulations based on Moldflow were conducted to acquire the warpages of the plastic parts produced under different processing conditions. A signal to noise analysis was conducted to analyze the effect of the factors, and the optimal processing parameters were also found out. ANOVA was also conducted to quantitatively analyze the percentage contributions of the processing parameters on the warpage. The verification results show that part warpage can be reduced effectively based on the optimal design results. (C) 2012 Elsevier Ltd. All rights reserved.

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