期刊
LANGMUIR
卷 30, 期 1, 页码 132-139出版社
AMER CHEMICAL SOC
DOI: 10.1021/la404552c
关键词
-
资金
- Research Grants Council of Hong Kong Special Administrative Region, China [HKU 719512E]
Looking foward to the future where the device becomes flexible and rollable, indium tin oxide (ITO) fabricated on the plastic substrate becomes indispensable. Metallization on the ITO plastic substrate is an essential and required process. Electroplating is a cost-effective and high-throughput metallization process; however, the poor surface coverage and interfacial adhesion between electroplated metal and ITO plastic substrate limits its applications. This paper develops a new method to directly electroplate metals having strong adhesion and uniform deposition on an ITO plastic substrate by using a combination of 3-mercaptopropyl-trimethoxysilane (MPS) self-assembled monolayers (SAMs) and a sweeping potential technique. An impedance capacitive analysis supports the proposed bridging link model for MPS SAMs at the interface between the ITO and the electrolyte.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据