Mechanisms of atomic layer deposition on substrates with ultkahigh aspect ratios

Atomic layer deposition (ALD) appears to be uniquely suited for coating substrates with ultrahigh aspect ratios (>= 10(3)), including nanoporous solids. Here, we study the ALD of Cu and Cu3N on the inner surfaces of low-density nanoporous silica aerogel monoliths. Results show that Cu depth profiles in nanoporous monoliths are limited not only by Knudsen diffusion of heavier precursor molecules into the pores, as currently believed, but also by other processes such as the interaction of precursor and reaction product molecules with pore walls. Similar behavior has also been observed for Fe, Ru, and Pt ALD on aerogels. On the basis of these results, we discuss design rules for ALD precursors specifically geared for coating nanoporous solids.