期刊
LAB ON A CHIP
卷 13, 期 8, 页码 1468-1471出版社
ROYAL SOC CHEMISTRY
DOI: 10.1039/c3lc41362d
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资金
- NSF Graduate Research Fellowship
- Haas Scholars Program grant
- trans-NIH Genes
- Environment and Health Initiative
- Biological Response Indicators of Environmental Systems Center [U54 ES016115-01]
- Mathies Royalty Fund
The production of hot embossed plastic microfluidic devices is demonstrated in 1-2 h by exploiting vinyl adhesive stickers as masks for electroplating nickel molds. The sticker masks are cut directly from a CAD design using a cutting plotter and transferred to steel wafers for nickel electroplating. The resulting nickel molds are used to hot emboss a variety of plastic substrates, including cyclo-olefin copolymer and THV fluorinated thermoplastic elastomer. Completed devices are formed by bonding a blank sheet to the embossed layer using a solvent-assisted lamination method. For example, a microfluidic valve array or automaton and a droplet generator were fabricated with less than 100 mm x-y plane feature resolution, to within 9% of the target height, and with 90 perpendicular to 11% height uniformity over 5 cm. This approach for mold fabrication, embossing, and bonding reduces fabrication time and cost for research applications by avoiding photoresists, lithography masks, and the cleanroom.
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