期刊
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
卷 27, 期 3, 页码 L9-L13出版社
A V S AMER INST PHYSICS
DOI: 10.1116/1.3089244
关键词
buckling; finite element analysis; gold; metallic thin films
Buckling of stiff thin films on compliant substrates represents a variety of applications, ranging from stretchable electronics to micro-nanometrology. Different but complementary to previously reported sinusoidal buckling waves, this letter presents a nonsinusoidal surface profile of buckled thin Au films on compliant substrates, specifically, a secondary dip on top of buckling wave or rather broadened wave top with very sharp trough. This nonsinusoidal profile is likely due to tension/compression asymmetry, i.e., different strengths in tension and compression resulted from the polycrystalline, grained microstructure of metal film. Finite element analysis with asymmetric tension/compression material model has reproduced the experiments well qualitatively.
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