4.5 Article

Removal of islands from micro-dimple arrays prepared by through-mask electrochemical micromachining

出版社

ELSEVIER SCIENCE INC
DOI: 10.1016/j.precisioneng.2014.09.002

关键词

Micro-dimple array; Island; Through-mask electrochemical micromachining; Thick mask; Micro-dimple profile

资金

  1. National Natural Science Foundation of China and Guangdong Province [U1134003]
  2. Jiangsu Innovation Program for Graduate Education [CXLX13_142]
  3. Fundamental Research Funds for the Central Universities

向作者/读者索取更多资源

Surface texture plays a fundamental role in tribology, allowing for the improvement of the friction and lubrication performances of various mechanical components. Through-mask electrochemical micromachining (TMEMM) is a feasible alternative for generating surface texture. However, in TMEMM the island phenomenon often occurs, which weakens the effect of micro-dimples on tribological properties. This study is the first to focus on removing islands by using a thick mask. Simulations were performed to analyze the distribution of current density on an anode surface and predict the anodic dissolution process under a thick mask. For reuse, the mask was fabricated from a PDMS layer measuring 200 mu m in thickness. The simulations and experimental results verified that the island phenomenon can be avoided by use of a thick (200 mu m) mask. In addition, the effects of the applied voltage and machining time on micro-dimple formation were experimentally investigated. The results indicate that the dimensions of micro-dimples are mainly determined by the applied voltage: the micro-dimple diameter increases with increasing voltage, and machining localization increases sharply. With prolonged machining time at constant voltage, only a slight increase in dimple diameter is observed. Moreover, because of a current valve in the electrolyte, micro-dimples with a flat bottom can be obtained at low voltage, whereas micro-dimples with a round bottom can be generated at high voltage. (C) 2014 Elsevier Inc. All rights reserved.

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