4.6 Article

Design and evaluation of pad grooves for copper CMP

相关参考文献

注意:仅列出部分参考文献,下载原文获取全部文献信息。
Article Electrochemistry

Implications of wafer-size scale-up on frictional, thermal, and kinetic attributes of interlayer dielectric CMP process

D Rosales-Yeomans et al.

JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2006)

Article Electrochemistry

Electrode phenomena of sodium diborate glass on biasing with a DC pulse train

A Doi

JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2004)