Process optimization in high-average-power ultrashort pulse laser microfabrication: how laser process parameters influence efficiency, throughput and quality

In this paper, laser processing of technical grade stainless steel and copper using high-average-power ultrashort pulse lasers is studied in order to gain deeper insight into material removal for microfabrication. A high-pulse repetition frequency picosecond and femtosecond laser is used in conjunction with high-performance galvanometer scanners and an in-house developed two-axis polygon scanner system. By varying the processing parameters such as wavelength, pulse length, fluence and repetition rate, cavities of standardized geometry are fabricated and analyzed. From the depths of the cavities produced, the ablation rate and removal efficiency are estimated. In addition, the quality of the cavities is evaluated by means of scanning electron microscope micrographs or rather surface roughness measurements. From the results obtained, the influence of the machining parameters on material removal and machining quality is discussed. In addition, it is shown that both material removal rate and quality increase by using femtosecond compared to picosecond laser pulses. On stainless steel, a maximum throughput of 6.81 mm(3)/min is achieved with 32 W femtosecond laser powers; if using 187 W picosecond laser powers, the maximum is 15.04 mm(3)/min, respectively. On copper, the maximum throughputs are 6.1 mm(3)/min and 21.4 mm(3)/min, obtained with 32 W femtosecond and 187 W picosecond laser powers. The findings indicate that ultrashort pulses in the mid-fluence regime yield most efficient material removal. In conclusion, from the results of this analysis, a range of optimum processing parameters are derived feasible to enhance machining efficiency, throughput and quality in high-rate micromachining. The work carried out here clearly opens the way to significant industrial applications.