Effect of thermal expansion on shape memory behavior of polyurethane and its nanocomposites

The effects of thermal expansion on shape memory performance of shape memory polyurethanes and their nanocomposites with organoclay, carbon nanofiber (CNF), silicon carbide (SiC), and carbon black (CB) were evaluated. The shape memory test cycle involved tensile deformation at above the trigger temperature to initiate shape memory function, cooling to room temperature to fix the shape, and shape recovery induced by heating to above the trigger temperature. Phenomenological models were used to interpret the experimental data on coefficient of thermal expansion (CTE). It was found that Kerner model showed good fit for composites of SiC and CB, and Halpin model gave better fit for composites of organoclay and CNF. It was observed that thermal expansion exerts negative effect on recovered strain, the extent of which depends on the magnitude of temperature gradient, CTE, and the level of tensile strain. (C) 2008 Wiley Periodicals, Inc.