相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Microstructural stability of Sn-1Ag-0.5Cu-xAl (x=1, 1.5, and 2 wt.%) solder alloys and the effects of high-temperature aging on their mechanical properties
Mohd Faizul Mohd Sabri et al.
MATERIALS CHARACTERIZATION (2013)
IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms
Ousama M. Abdelhadi et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2012)
Electrical resistivity of liquid binary and ternary alloys
M. Ornat et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2011)
Study of electrical transport properties of liquid semiconductor binary alloys using pseudopotential theory
Aditya M. Vora
PHYSICS AND CHEMISTRY OF LIQUIDS (2011)
On electrical resistivity evolution of Sn-Sb10 melt during isothermal processes at different temperatures
Dong-Dong Yang et al.
PHYSICS AND CHEMISTRY OF LIQUIDS (2011)
Influence of thermal aging on microhardness and microstructure of Sn-0.3Ag-0.7Cu-xIn lead-free solders
Kannachai Kanlayasiri et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2010)
Different solidification behaviours of Bi-10wt%Te alloy induced by liquid structural change
Zhong-Yue Huang et al.
PHYSICS AND CHEMISTRY OF LIQUIDS (2010)
Creep behavior of SnAgCu solders with rare earth Ce doping
Zhang Liang et al.
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA (2010)
Effect of Sn on reversibility of liquid-liquid transition in Bi-Sb-Sn alloys
Xianfen Li et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2008)
Hump phenomenon on resistivity-temperature curve in liquid Bi, Sb and their alloys
Xian-Fen Li et al.
PHYSICS AND CHEMISTRY OF LIQUIDS (2007)
Anomalous change of electrical resistivity with temperature in liquid Pb-Sn alloys
XF Li et al.
PHYSICA B-CONDENSED MATTER (2005)
Internal friction method: suitable also for structural changes of liquids
ZG Zhu et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2004)
Electrical resistivity of liquid Cu-Ce alloys
MI Ivanov et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2004)
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
K Zeng et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2002)
分享论文
