期刊
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY
卷 21, 期 1, 页码 95-99出版社
TECHNICAL ASSOC PHOTOPOLYMERS,JAPAN
DOI: 10.2494/photopolymer.21.95
关键词
polyimide film; coefficient of thermal expansion; package substrate
One of the key issues for semiconductor chip packaging in. microelectronics technology is the reliability of the,chip packaging during harsh temperature change in practical use. Typically, a thermal expansion mismatch between a silicon chip and a package substrate causes cracks between interconnecting bumps after the thermal cycling when the wiring pitch becomes fine. To overcome this problem, we have developed a new dielectric film which has extremely. low CTE (Coefficient of Thermal Expansion) with the almost equal value to silicon over a wide range of temperature. The film will realize thermally-reliable interconnection at package substrate fabrication and in high temperature applications.
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