期刊
PHILOSOPHICAL MAGAZINE
卷 95, 期 4, 页码 367-381出版社
TAYLOR & FRANCIS LTD
DOI: 10.1080/14786435.2015.1006293
关键词
microstructure; copper; friction-stir welding; texture; electron backscatter diffraction (EBSD)
类别
资金
- Tohoku University
The microstructural evolution of pure copper during friction-stir welding was found to be principally influenced by welding temperature. At temperatures below ~0.5 T-m (where T-m is melting point), the microstructure was shown to be essentially determined by continuous recrystallization, leading to significant grain refinement and related material strengthening in the stir zone. In contrast, grain structure development at temperatures above ~0.5 T-m was dominated by discontinuous recrystallization producing a relatively coarse grain structure in the stir zone and giving rise to material softening.
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