期刊
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
卷 11, 期 3, 页码 2196-2207出版社
AMER SCIENTIFIC PUBLISHERS
DOI: 10.1166/jnn.2011.3557
关键词
Nanofluid; Thermal Conductivity; Molecular Dynamics; Stochastic Simulation
类别
资金
- Department of Science and Technology, Goverment of India [SR/S5/NM-91/2002]
- Defense Research and Development Organization, Goverment of India [ERIP/ER/0700335/M/01/1014]
A model to predict the enhanced thermal conductivity of water based copper nanofluid on the basis of molecular dynamics simulation coupled with stochastic simulation shows for the first time that the temperature of a copper nanoparticle colliding with a heat source can rise rapidly within the short collision period (e.g., 10-50 ps) estimated by impact dynamics due to phonon transfer. Thereafter the particles undergo Brownian movement in the base fluid and transfer the excess heat in about 2 to 3 ms to the surrounding fluid resulting in an appreciable enhancement of the thermal conductivity of the fluid. Microconvection has minor contribution to the enhanced thermal conductivity of nanofluids. The predicted thermal conductivity of nanofluid and its variation with the volume fraction of the nanoparticles agree well with the present experiments, as well as, with the data reported in the literature.
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