期刊
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
卷 22, 期 10, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1088/0960-1317/22/10/105017
关键词
-
类别
资金
- National Science Foundation of China [61176113]
- Fundamental Research Funds for the Central Universities
This paper presents a facile method for the fabrication of on-chip three-dimensional (3D) microcoils inside fused silica. The main fabrication process involves two steps: (1) creating 3D helical microchannels inside fused silica using an improved femtosecond laser irradiation assisted by chemical etching (FLICE) technology and (2) conductive treatment by injecting metal gallium into the helical microchannels. The high aspect ratio 3D helical microcoil was prepared inside fused silica with a diameter of 100 mu m, a length of 880 mu m and a pitch of coil of 44 mu m. The method is flexible to fabricate microcoils inside fused silica with arbitrary geometry configurations and different coil properties. This type of microcoils can be easily integrated into 'lab on a chip' (LOC) platform inside fused silica substrate.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据