Hydrofluoric acid-assisted bonding of diatoms with SiO2-based substrates for microsystem application

Diatom, with delicate three-dimensional porous structures and texture, has a promising application in micro-nanotechnology especially biosensing. In order to achieve a diatom-based compound substrate, a fabrication technique is developed for hydrofluoric acid (HF) bonding of diatom with SiO2-based substrate at a temperature as low as 80 degrees C. The bonding conditions are optimized with various HF concentrations and applied pressure. The optimized HF concentration is found to be in the range of 0.8% to 1.2% and applied pressure is from 0.4.0 MPa to 0.6.0 MPa. The morphological integrity and nano-microscale substructures of the diatoms after bonding are characterized. The bonding strength is approximately 0.435 MPa.