期刊
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
卷 19, 期 6, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1088/0960-1317/19/6/067001
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资金
- Flemish government [GOA ZKB2156]
- Power MEMS programs
- Flemish government [GOA ZKB2156]
- Power MEMS programs
This note presents a simple, low-cost technology to fabricate very deep isotropically etched features in glass wafers. A process based on fast etching glass combined with a stress-optimized molybdenum mask layer and a photoresist was found to be very suitable for such purposes. The obtained performance, up to 1.2 mm deep etching, rivals the best existing techniques while being more cost-competitive and using widely available equipment.
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