期刊
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
卷 18, 期 12, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1088/0960-1317/18/12/125020
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- Danish Research Council for Technology and Production [2116-04-001]
This paper summarizes the results of the process optimization for SU-8 films with thicknesses <= 5 mu m. The influence of soft-bake conditions, exposure dose and post-exposure-bake parameters on residual film stress, structural stability and lithographic resolution was investigated. Conventionally, the SU-8 is soft-baked after spin coating to remove the solvent. After the exposure, a post-exposure bake at a high temperature T-PEB >= 90 degrees C is required to cross-link the resist. However, for thin SU-8 films this often results in cracking or delamination due to residual film stress. The approach of the process optimization is to keep a considerable amount of the solvent in the SU-8 before exposure to facilitate photo-acid diffusion and to increase the mobility of the monomers. The experiments demonstrate that a replacement of the soft-bake by a short solvent evaporation time at ambient temperature allows cross-linking of the thin SU-8 films even at a low T-PEB = 50 degrees C. Fourier-transform infrared spectroscopy is used to confirm the increased cross-linking density. The low thermal stress due to the reduced TPEB and the improved structural stability result in crack-free structures and solve the issue of delamination. The knowledge of the influence of different processing parameters on the responses allows the design of optimized processes for thin SU-8 films depending on the specific application.
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