期刊
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
卷 21, 期 4, 页码 830-839出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2012.2194771
关键词
Fatigue; lifetime; microelectromechanical systems (MEMS); oscillation; resonator; single crystal silicon (SCS)
类别
资金
- New Energy and Industrial Technology Development Organization of Japan
The authors used a ramping-amplitude fatigue-test method to perform low-cycle fatigue tests in micrometer-sized single-crystal-silicon specimens using a resonant-type fatigue-test device. Very short delayed fractures from 4 ms to 29 s were observed by controlling the amplitude ramping rates with two self-oscillation electric circuits and different parameters. These lifetimes were converted to corresponding constant-amplitude life-times from 10(1) to 10(5) cycles using the relationship derived from a crack-growth analysis. S-N plots of measured lifetimes exhibited the transition of fatigue lives at the high-cycle region with a crack-growth exponent of 18.0, to the static fracture strength of 6.50 GPa at the low-cycle region corresponding to the original crack length of 7.9 nm. The existence of a very rapid fatigue fracture within 1 s was confirmed. From the obtained crack-growth parameters, the evolution of crack length and the effects of humidity were discussed.
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