4.5 Article

High-Q Integrated CMOS-MEMS Resonators With Deep-Submicrometer Gaps and Quasi-Linear Frequency Tuning

期刊

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
卷 21, 期 3, 页码 688-701

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2012.2189360

关键词

Capacitive transduction; CMOS-MEMS; frequency tuning; micromechanical resonator; monolithic integration; RF-MEMS; temperature compensation

资金

  1. National Science Council (NSC) of Taiwan [NSC-100-2221-E-007-033]
  2. Toward World-Class University

向作者/读者索取更多资源

Integrated CMOS-MEMS free-free beam resonators using pull-in mechanism to enable deep-submicrometer electrode-to-resonator gap spacing without interference in their mechanical boundary conditions (BCs) have been demonstrated simultaneously with low motional impedance and high Q. The key to attaining high Q relies on a decoupling design between pull-in frames for gap reduction and mechanical BCs of resonators. In addition, the use of metal-SiO2 composite structures has been proved to greatly benefit the thermal stability of CMOS-MEMS resonators. Furthermore, tuning electrodes underneath pull-in frames were designed to offer quasi-linear frequency tuning capability where linear relationship between tuning voltage and frequency was achieved. In this paper, CMOS-MEMS free-free beam resonators with gap spacings of 110, 210, and 275 nm, respectively, were tested under direct one-port measurement in vacuum, demonstrating a resonator Q greater than 2000 and a motional impedance as low as 112 k Omega and, at the same time, allowing quasi-linear frequency tuning to achieve a total tuning range of 5000 ppm and a sensitivity of 83.3 ppm/V at 11.5 MHz with zero dc power consumption. Such a resonator monolithically integrated with a CMOS amplifier, totally occupying a die area of only 300 mu m x 130 mu m, was also tested with enhanced performance, benefiting future timing reference and RF synthesizing applications. [2011-0223]

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