期刊
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
卷 19, 期 2, 页码 273-281出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2010.2040947
关键词
Laser processing; microforming; nanoindentation; shock pressure; superplastic; ultrahigh strain rate forming
类别
资金
- U.S. National Science Foundation [CMMI-0547636]
- Directorate For Engineering
- Div Of Civil, Mechanical, & Manufact Inn [0928752] Funding Source: National Science Foundation
Microforming of metals has always been a challenge because of the limited formability of metals at the microscale. This paper investigates an innovative microforming technique: microscale laser dynamic forming (mu LDF), which induces 3-D superplastic forming in metallic thin films. This forming process proceeds in a sequence of laser irradiation and ionization of ablative coating, shockwave generation and propagation in metallic thin films, and conformation of metallic thin films to the shape of microscale molds. Because the deformation proceeds at ultrahigh strain rates, it is found that materials experience superplastic deformation at the microscale. In this paper, experiments are systematically carried out to understand the deformation characteristics of mu LDF. The topologies and dimensions of the deformed samples are characterized by scanning electron microscopy and optical profilometry. The thickness variations are characterized by slicing the cross section of the deformed material using the focused ion beam. The magnitude of deformation depth in mu LDF is determined primarily by three critical factors: film thickness, mold geometry, and laser intensity. The relationships between these factors are explored in process maps to find suitable processing conditions for mu LDF. Nanoindentation tests are conducted to show that the strength of the thin films is increased significantly after mu LDF. [2009-0256]
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