Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu

Accelerated thermal cycling (ATC) tests are conducted for various chip resistor assemblies using the lead-based (SnPb) and lead-free (SnAgCu) solders. The corresponding life prediction models are developed by employing the well-established energy density approach. The life prediction model constants are obtained from the ATC test data. The models are utilized to predict the lifetimes of chip resistor assemblies under a mobile device field condition. The analysis indicates that the lead-free solder used in the chip resistor assembly would offer a longer lifetime under a field condition compared to the lead-based solder regardless of chip resistor types even when a reverse trend is observed in the ATC test results.