期刊
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY
卷 27, 期 9, 页码 2701-2707出版社
KOREAN SOC MECHANICAL ENGINEERS
DOI: 10.1007/s12206-013-0714-6
关键词
SU-8; Elastic constants; Visco-elasticity; Thermo-mechanical effects; Dynamic mechanical analysis (DMA)
A representative fabrication processing of SU-8 photoresist, Ultraviolet (UV) lithography is usually composed of spin coat, soft bake, UV exposure, post exposure bake (PEB), development and optional hard bake, etc. The exposed region of SU-8 is crosslinked during the PEB process and its physical properties highly depend on UV exposure and PEB condition. This work was initiated to investigate if thermal baking after fabrication can affect the mechanical properties of SU-8 photoresist material because SU-8 is trying to be used as a structural material for MEMS operated at high temperature. Since a temperature of 95 degrees C is normally recommended for PEB process, elevated temperatures up to 200 degrees C were considered for the optional hard bake process. The viscoelastic material properties were measured by dynamic mechanical analyses (DMA). Also, pulling tests were performed to obtain Young's modulus and Poisson's ratio as a function of strain rate in a wide temperature range. From this study, the effects of temperature on the elastic and viscoelastic material properties of SU-8 were obtained.
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