相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
Wen-Wei Shen et al.
NANOSCALE RESEARCH LETTERS (2017)
Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration
Yu-An Shen et al.
SCRIPTA MATERIALIA (2017)
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
Wen-Wei Shen et al.
NANOSCALE RESEARCH LETTERS (2017)
A Review of Failure Analysis Methods for Advanced 3D Microelectronic Packages
Yan Li et al.
JOURNAL OF ELECTRONIC MATERIALS (2016)
Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter
Yingxia Liu et al.
ACTA MATERIALIA (2016)
Investigation of diffusion behavior in Cu-Sn solid state diffusion couples
Yuan Yuan et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration
T. L. Yang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2015)
Materials challenges in three-dimensional integrated circuits
Kuan-Neng Chen et al.
MRS BULLETIN (2015)
Effects of anisotropic β-Sn alloys on Cu diffusion under a temperature gradient
Wei-Neng Hsu et al.
ACTA MATERIALIA (2014)
EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing
S. J. Wang et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art
Dapeng Liu et al.
JOURNAL OF ELECTRONIC PACKAGING (2014)
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics
Y. J. Chen et al.
MICROELECTRONICS RELIABILITY (2013)
Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
Ming-Yung Guo et al.
INTERMETALLICS (2012)
Electromigration in Sn-Cu intermetallic compounds
C. C. Wei et al.
JOURNAL OF APPLIED PHYSICS (2009)
Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
Minhua Lu et al.
APPLIED PHYSICS LETTERS (2008)
Solid state diffusion in Cu-Sn and Ni-Sn diffusion couples with flip-chip scale dimensions
Riet Labie et al.
INTERMETALLICS (2007)