期刊
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
卷 25, 期 8, 页码 3566-3571出版社
SPRINGER
DOI: 10.1007/s10854-014-2057-1
关键词
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The effects of rare element Ga on solderability, microstructure, and mechanical properties of Sn-0.5Ag-0.7Cu lead-free solder were investigated. The experimental results show that Ga plays a positive role in improving the wettability and the microstructure of the solder. When the content of Ga is at 0.5 wt%, the grain size of the solder is smaller and the shear force is enhanced greatly. It is also found that the thickness of the IMCs at the solder/Cu interface is reduced with proper addition of Ga. The increase of mechanical properties may be related to the refining of IMCs of the solder due to Ga addition.
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