期刊
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
卷 28, 期 7, 页码 661-665出版社
JOURNAL MATER SCI TECHNOL
DOI: 10.1016/S1005-0302(12)60113-3
关键词
Sn3.0Ag0.5Cu; Diamond; Composite solder; Chemical plating
资金
- Scientific and Technological Development Projects in Shandong Province [2010GGX10307]
Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder powders, mixing with flux and reflowing at 260 degrees C for 60 s. The spreading areas of composite solder were calculated and the distributions of copper-coated diamonds were characterized. When diamond additions were below 3 wt%, the spreading area decreased with diamond additions, and the diamonds distributed mainly at the interface between solder and Cu pad; however, when additions were beyond 4 wt%, the discharge of diamond particle occurred, and the spreading area increased due to the reduction of surface energy.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据