相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate
QingKe Zhang et al.
JOURNAL OF MATERIALS RESEARCH (2010)
Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate
H. F. Zou et al.
SCRIPTA MATERIALIA (2009)
Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint
Hefei Zou et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2008)
Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film
Q. S. Zhu et al.
JOURNAL OF MATERIALS RESEARCH (2008)
Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints
P. J. Shang et al.
SCRIPTA MATERIALIA (2008)
Shearing tests of solder joints on tape ball grid array substrates
B. Y. Wu et al.
JOURNAL OF MATERIALS RESEARCH (2006)
Fracture of SnBi/Ni(P) interfaces
PL Liu et al.
JOURNAL OF MATERIALS RESEARCH (2005)
Interfacial reactions between lead-free solders and common base materials
T Laurila et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2005)
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
K Zeng et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2002)
Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect
PL Liu et al.
JOURNAL OF MATERIALS RESEARCH (2001)
Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect
PL Liu et al.
SCRIPTA MATERIALIA (2001)
分享论文
