期刊
JOURNAL OF MATERIALS RESEARCH
卷 25, 期 11, 页码 2078-2081出版社
MATERIALS RESEARCH SOC
DOI: 10.1557/JMR.2010.0268
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资金
- National Science Council (R.O.C.) [NSC99-2221-E-155-017, NSC99-2218-E-155-005]
The effect of Pd concentration on the soldering reaction between Ni and Sn-xPd alloys (x = 0-0.5 wt%) was investigated in this study. When the Pd concentration was low (x <= 0.05 wt%), the predominant reaction product was a layer of Ni(3)Sn(4). In contrast, an additional (Pd,Ni)Sn(4) layer deposited over the Ni(3)Sn(4) in the case of above 0.2 wt%. This microstructure evolution significantly weakened the strength of the interface, deteriorating the reliability of solder joints. A Pd-Ni-Sn isotherm simulated by the CALPHAD method was used to rationalize the above transition in the reaction product(s).
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