期刊
JOURNAL OF MATERIALS RESEARCH
卷 24, 期 3, 页码 1114-1126出版社
CAMBRIDGE UNIV PRESS
DOI: 10.1557/JMR.2009.0144
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A data analysis procedure has been developed to estimate the contact area in all elastoplastic indentation of a thin film bonded to a substrate. The procedure call be used to derive the elastic modulus and hardness of the film from the indentation load, displacement, and contact stiffness data at indentation depths that are a significant fraction of the film thickness. The analysis is based on Yu's elastic solution for the contact of a rigid conical punch on a layered half-space and uses an approach similar to the Oliver-Pharr method for bulk materials. The methodology is demonstrated for both compliant films oil stiff substrates and the reverse combination and shows improved accuracy over previous methods.
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