Fabrication of a thermoplastic multilayer microfluidic chip

Reservoir unsealed and boundary layer separation are two main issues in the fabrication of a multilayer poly(methyl methacrylate) (PMMA) microfluidic chip. In this paper, embedded sacrificial layer bonding (ESLB) and laser edge welding (LEW) are presented to avoid them. ESLB is performed by inserting a sacrificial-layer into a reservoir to enhance the transfer of bonding pressure among different layers. LEW is performed by using CO2 laser to weld the edge of a bonded multilayer chip. By using these two methods, a three-layer microchip and a five layer micro-mixer are fabricated. Our results demonstrated that ESLB and LEW can be implemented readily in the fabrication of a multilayer thermoplastic microfluidic chip which may facilitate the development of sophisticated microfluidic systems. (C) 2012 Elsevier B.V. All rights reserved.