4.6 Article

Effect of joining temperature on the microstructure and strength of tungsten/ferritic steel joints diffusion bonded with a nickel interlayer

期刊

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
卷 210, 期 13, 页码 1805-1810

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ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2010.06.012

关键词

Tungsten; Ferritic steel; Diffusion bonding; Microstructure; Joint strength

资金

  1. Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan

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A diffusion bonding process, for joining of tungsten to ferritic steel using nickel as an interlayer, was developed for nuclear component application. The effect of joining temperature on the microstructure and tensile strength of the joint was investigated in this work. Metallographic analysis revealed that a good bonding was obtained at both the tungsten/nickel and nickel/steel interfaces, and the diffusion products were identified in the diffusion zone. Nano-indentation test across the joining interfaces demonstrated the effect of solid solution hardening in the diffusion zone. Tensile test showed that the maximum average tensile strength of similar to 200 MPa was obtained for the joint diffusion bonded at 900 degrees C. The results were discussed in terms of the joining temperature and of the residual stress generated during joining process. Crown Copyright (C) 2010 Published by Elsevier B.V. All rights reserved.

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