期刊
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
卷 209, 期 6, 页码 2838-2846出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2008.06.057
关键词
LCD glass; Alumina substrates; Laser drilling; Underwater drilling
资金
- National Science Council (Taiwan) [NSC 95-2221-E-211-002]
The aim of this paper is to present and discuss data on underwater laser drilling techniques for brittle substrates. Drilling under water reduced substrate defects that typically result from conventional laser drilling in air. in this study, the substrates were submerged 1 mm beneath the water surface. A CO(2) laser was used to drill holes into LCD glass and alumina substrates. It was found that the underwater laser drilling quality for these materials is much better than that from laser drilling in air. Underwater laser drilling reduced the phenomena of micro-cracking and minimized the size of the area affected by heat from the laser. Also in this study, single-hole drilling and array-holes drilling by percussion and trepanning were conducted and analyzed both in air and underwater. The minimum distance between the two neighbour holes that can be obtained was much shorter in water than in air. The SEM photographs of the holes illustrate the contrast in drilling quality. The relationship between laser power, pulse repetition rate, and the hole quality was also evaluated. (c) 2008 Elsevier B.V. All rights reserved
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据