4.3 Article

Fabrication, integration and reliability of nanocomposite based embedded capacitors in microelectronics packaging

相关参考文献

注意:仅列出部分参考文献,下载原文获取全部文献信息。
Article Engineering, Electrical & Electronic

Microwave performance of MCM-D embedded capacitors with interconnects

JE Post

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS (2005)

Article Engineering, Electrical & Electronic

The synthesis and dielectric study of BaTiO3/polyimide nanocomposite films

NG Devaraju et al.

MICROELECTRONIC ENGINEERING (2005)

Review Automation & Control Systems

Embedded components in printed circuit boards: a processing technology review

W Jillek et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2005)

Article Physics, Applied

Unique architecture and concept for high-performance organic transistors

LP Ma et al.

APPLIED PHYSICS LETTERS (2004)

Article Engineering, Manufacturing

Dielectric nanocomposites for integral thin film capacitors: Materials design, fabrication, and integration issues

S Ramesh et al.

IEEE TRANSACTIONS ON ADVANCED PACKAGING (2003)

Article Materials Science, Ceramics

Low temperature chemical synthesis of nanosized ceramic powders

RN Das et al.

BRITISH CERAMIC TRANSACTIONS (2000)