期刊
JOURNAL OF LIGHTWAVE TECHNOLOGY
卷 31, 期 24, 页码 4142-4154出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JLT.2013.2288917
关键词
Hybrid silicon laser; optical communications; optical interconnections; silicon photonics; WDM source
资金
- U.S. Defense Advanced Research Project Agency (DARPA) [HR0011-08-09-0001]
Efficient multi-wavelength sources are essential to realize sub-pJ/bit modulated silicon photonic links for multi-TB/s interconnect applications. From a complete link perspective, we discuss the efficiency requirement for silicon WDM on-chip sources. A waveguide-coupled wall-plug efficiency (WPE) better than 10% is important to complement ultra-low power silicon photonic components for practical implementations. We propose a non-invasive hybrid, flip-chip integration approach using surface-normal coupling of an un-cooled III/V gain medium with a tunable wavelength selective silicon reflector. We show that a tunable, external-cavity WDM laser using such a hybrid integration approach can achieve high waveguide-coupled WPE when optimized. A proof-of-concept demonstration achieved a C-band tunable laser with an output power of more than 6 mW in the silicon waveguide, a tuning range of 15 nm, and a WPE of over 4.5%.
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