期刊
JOURNAL OF LIGHTWAVE TECHNOLOGY
卷 31, 期 24, 页码 4080-4086出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JLT.2013.2285382
关键词
Data communications; energy per bit; optical interconnects; optical waveguides
资金
- Delaware NASA EPSCoR RID Seed Grant Program
We analyze a chip-to-chip optical interconnect platform based on our recently developed flexible substrate integration technology. We show that the architecture achieves high bandwidth density (100 Tbs/cm(2)), and does not require optical alignment during packaging. These advantages make the flexible photonics platform a promising solution for chip-to-chip optical interconnects. We further report initial experimental characterizations of the flexible photonics platform fabricated using thermal nanoimprint patterning of glass waveguides and III-V die bonding.
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