期刊
JOURNAL OF LIGHTWAVE TECHNOLOGY
卷 30, 期 11, 页码 1563-1568出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JLT.2012.2188494
关键词
Chip-to-chip optical interconnection; 45-degree micromirrors; liquid-immersion exposure technique; single-mode waveguides
A new integration technique of a 45-degree micromirror providing a vertical coupling between a free-space wave and a guided wave in a dielectric-glass waveguide for high-density intra-board optical interconnection was described. A planar waveguide consisting of a 4-mu m-thickness GeO2:SiO2 guiding core layer and a 2-mu m-thickness SiO2 cladding layer on an SiO2 substrate was used for characterization of the micromirror. A trench with 8-mu m depth and 8-mu m width was formed in the waveguide by using a dry etching technique. A photoresist filling the trench was exposed at an angle of 45 degrees in the water to give a 45-degree taper in the trench. Au was evaporated on the taper to give high-reflection micromirror. An excess loss due to the micromirror insertion was estimated to be about 2 dB by comparing insertion losses of waveguides with and without the micromirror.
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