期刊
JOURNAL OF LIGHTWAVE TECHNOLOGY
卷 26, 期 1-4, 页码 243-250出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JLT.2007.911115
关键词
45 degrees micromirrors; hard molding; optical interconnects; optical printed circuit board; polymer waveguide; ultraviolet embossing
This paper presents the latest progress toward fully embedded board-level optical interconnects in the aspect of waveguide fabrication and device integration. A one-step pattern transfer method is used to form a large cross-section multimode waveguide array with 45 degrees micromirrors by silicon hard molding method. Optimized by a novel spin-coating surface smoothing method for the master mold, the waveguide propagation loss is reduced to 0.09 dB/cm. The coupling efficiency of the metal-coated reflecting mirror, which is embedded in the thin-film waveguide, is simulated by an M-2 factor revised Gaussian beam method and is experimentally measured to be 85%. The active optoelectronic devices, vertical surface emitter lasers and p-i-n photodiodes, are integrated with the mirror-ended waveguide array and successfully demonstrate a 10 Gbps signal transmission over the embeddable optical layer.
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